Infrared Hot Air BGA Rework Station Repairing Laptop PCB / Motherboard

Infrared Hot Air BGA Rework Station Repairing Laptop PCB / Motherboard?Feature

1. Using the new?SAMSUNG microcomputer processor PID?programmable temperature control technology and uses an infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.

2. Adopt?infrared weld technology?which independent exploration , infrared penetration strength , components uniform heating , beyond the traditional hot air heating vowed to prevent blow off the IC surrounding small components.

3.?Technician focused infrared heat?is easy to target most component removal / replacement and re-work.

4. Infrared heat source bulbs are?long-lived , un-expensive and easily replaced .

5. Has bright delicate ,?low voltage LED lighting , safety and energy conservation.

6.It has?External Sensor Temperature control mode?, that is detected by the sensor IC surface temperature control temperature ,?this function is good for freshman operation , it’s safe way protect??components .

7.MountTechnology ( SMT ) components 15-35cm in size.

8. This machine has 540W heating system , widely to 120mm*120mm.

9.?Preheating plate color is black?, from the photics point of view , black color?easy to absorb heating , shorten the warm-up time.

10. Powerful human function design, with the following functions

A.?Temperature correction function?Correction of temperature range -50°C~+50 °C ( Infrared lamp analog value 580 ).

B.?Celsius / Fahrenheit temperature display function

11. This machine also have?hot air reworks and soldering iron function?, if you have the device , you can used for all of the components solder , desoldering , preheating , repair all components , especially Micro BGA components.??

Infrared Hot Air BGA Rework Station Repairing Laptop PCB / Motherboard?Technical data

voltage? AC220V±10%

Max?power?consumption 1415W

Preheating station parts

Max?power?consumption 540W?

Light-emitting?components Far?infrared?heating?plate

Temperature?Range 50°C-300°C / 122°F~572°F or 50?°C?~200?°C?/??122°F~488°F

Display?Type LED

?Preheating?area 120*120mm

Infrared?lamp?part

Max?power?consumption 150W

Light-emitting?components Infrared?emission?lamp

Temperature?Range 100°C-350°C / 212°F~662°F

Temperature?Stability ±1°C

Display?Type LED

Effective?irradiation?area 35*35mm

Come with 2 lens cup , you can be choice two of ?lens cup from ?28mm?/ 38mm /48mm.

Soldering?station?part?

Max?power?consumption 75W

Heating?components imported?heater

Temperature?Range 200°C-480°C / 392°F~896°F

Temperature?Stability ±1°C(statics)?

Tip?of?ground?voltage <2mV

Tip?ground?impedance?<2?ohm

Display?Type LED?Display

Handle?cable?length ≥100cm

Max?power?consumption 700W

Heating?components?Skeleton-type?ceramic?heater

Airflow?type Brushless?fan?spiral?wind?

Air?Flow ≤130?L / min

Temperature?Range100°C-480°C / 212°F~896°F

Temperature?Stability ±1°C(statics)?

Display?Type LED

Handle?cable?length ≥100cm

Operation infrared?BGA rework station?NOTICE

1. Repair circuit boards required precautions and necessary protective measures

1)To ensure that both sides of the circuit board preheat zone without fusible explosive flammable components , like Plastic , Display , Phone camera , LED , Electrolytic capacitors.

2) Ensure that no combustible fusible explosive components in Infrared light can shine on the area, If you can not avoid , Must use reflective paper keep out that. like:Plastic,Display , Phone camera , LED , Electrolytic capacitors.

2. According to IC size , use a suitable diameter lamp cup(lamp cup size larger than IC size) ; Install lights Cup minimize the distance between lamp and IC , to facilitates heating.

3. Ensure that the working environment is no greater airflow to prevent heat loss , well sheltered measures when necessary.

4. Apply solder paste to the IC before the desoldering , also you can early preheat then Apply solder paste , Especially BGA package IC , should be early preheat then apply solder paste , the can make solder paste penetrate into the bottom of the IC.

5.?Wear heat protective gloves and goggles. Place the visor , good shading measures to protect the eyes.

6. Turn on the Infrared light power , Set the temperature to about 280°C . Make the appropriate adjustments ba